Recent development of temperature compensated SAW devices

Ken Ya Hashimoto, Michio Kadota, Takeshi Nakao, Masanori Ueda, Michio Miura, Hiroyuki Nakamura, Hidekazu Nakanishi, Kenji Suzuki

研究成果: Conference contribution

43 被引用数 (Scopus)

抄録

This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO 2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.

本文言語English
ホスト出版物のタイトル2011 IEEE International Ultrasonics Symposium, IUS 2011
ページ79-86
ページ数8
DOI
出版ステータスPublished - 2011
イベント2011 IEEE International Ultrasonics Symposium, IUS 2011 - Orlando, FL, United States
継続期間: 2011 10月 182011 10月 21

出版物シリーズ

名前IEEE International Ultrasonics Symposium, IUS
ISSN(印刷版)1948-5719
ISSN(電子版)1948-5727

Other

Other2011 IEEE International Ultrasonics Symposium, IUS 2011
国/地域United States
CityOrlando, FL
Period11/10/1811/10/21

ASJC Scopus subject areas

  • 音響学および超音波学

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