TY - GEN
T1 - Recent development of temperature compensated SAW devices
AU - Hashimoto, Ken Ya
AU - Kadota, Michio
AU - Nakao, Takeshi
AU - Ueda, Masanori
AU - Miura, Michio
AU - Nakamura, Hiroyuki
AU - Nakanishi, Hidekazu
AU - Suzuki, Kenji
PY - 2011
Y1 - 2011
N2 - This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO 2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.
AB - This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO 2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.
UR - http://www.scopus.com/inward/record.url?scp=84869036619&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84869036619&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2011.0021
DO - 10.1109/ULTSYM.2011.0021
M3 - Conference contribution
AN - SCOPUS:84869036619
SN - 9781457712531
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 79
EP - 86
BT - 2011 IEEE International Ultrasonics Symposium, IUS 2011
T2 - 2011 IEEE International Ultrasonics Symposium, IUS 2011
Y2 - 18 October 2011 through 21 October 2011
ER -