Reactive etching of platinum-manganese using a pulse-time-modulated chlorine plasma and a H2 plasma post-etch corrosion treatment

Shinya Kumagai, Toshiaki Shiraiwa, Seiji Samukawa

研究成果: Article査読

7 被引用数 (Scopus)

抄録

The highly anisotropic and corrosion-less etching of a PtMn thin film using a pulse-time-modulated (TM) chlorine electron-cyclotron-resonance plasma was discussed. The PtMn etching rate was found to considerably increase using TM plasma, when compared with conventional continuous-wave plasma. It was also observed that the formation of etching residues and post-etch corrosion products was reduced by increasing the pulse-off time of the TM plasma. It was thus concluded that the combination of TM chlorine plasma etching and the hydrogen-plasma post-exposure treatment can successfully pattern highly anisotropic vertical etched profiles with sub-micron width and no critical-dimension loss.

本文言語English
ページ(範囲)1093-1100
ページ数8
ジャーナルJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
22
4
DOI
出版ステータスPublished - 2004 7月 1

ASJC Scopus subject areas

  • 凝縮系物理学
  • 表面および界面
  • 表面、皮膜および薄膜

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