Reaction bonding of microstructured silicon carbide using polymer and silicon thin film

K. Rajanna, S. Tanaka, T. Itoh, M. Esashi

研究成果: Conference article

抜粋

We report the successful bonding of microstructured Silicon carbide using the reaction between polymer layer and sputtered silicon thin film. The necessary steps and the process parameters have been optimized. The bonded substrates have been analyzed using optical microscope, SEM/EDX and ESCA. The substrates were also tested for their bond strength. It has been found that optimum combination of silicon film thickness and polymer layer in sandwich configuration is necessary for achieving better bond strength.

元の言語English
ページ(範囲)1527-1530
ページ数4
ジャーナルMaterials Science Forum
457-460
発行部数II
DOI
出版物ステータスPublished - 2004 1 1
イベントProceedings of the 10th International Conference on Silicon Carbide and Related Materials, ICSCRM 2003 - Lyon, France
継続期間: 2003 10 52003 10 10

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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