RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

研究成果: Conference contribution

抄録

A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.

本文言語English
ホスト出版物のタイトルProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
出版社Institute of Electrical and Electronics Engineers Inc.
ページ811-816
ページ数6
ISBN(電子版)9781728161808
DOI
出版ステータスPublished - 2020 6
イベント70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
継続期間: 2020 6 32020 6 30

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(印刷版)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
国/地域United States
CityOrlando
Period20/6/320/6/30

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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