Quality control of grain boundaries in copper thin films used for 3D interconnections

Takahiro Nakanishi, Ken Suzuki, Hideo Miura

研究成果: Conference contribution

抄録

In this study, the quality of grain boundaries was evaluated by measuring their strength. In order to evaluate the strength of grain boundaries quantitatively, a micro-tensile test method that can measure the strength of a grain boundary has been developed. A focused ion beam was used for making a fine columnar sample which consisted of two grains in series. The sample was jointed to a small both ends fixed beam made of single-crystalline silicon. A tensile load was applied and the deformation of the sample and the beam was monitored by a scanning electron microscope to measure the load-displacement relationship of the sample. The relationship between the factors of controlling strength and the mechanical properties of the copper thin films was clarified quantitatively by using the micro-tensile test.

本文言語English
ホスト出版物のタイトル2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
ホスト出版物のサブタイトルChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ88-91
ページ数4
ISBN(電子版)9781479977277
DOI
出版ステータスPublished - 2014
イベント9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China
継続期間: 2014 10 222014 10 24

出版物シリーズ

名前2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan, Province of China
CityTaipei
Period14/10/2214/10/24

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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