Properties of intermetallic compound joint made from evaporated Ag/Cu/Sn films

T. Takahashi, S. Komatsu, Tatsuoki Kono

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Pb-based solders that contain a great amount of toxic Pb are still used as the high-melting-temperature-type solders to join power semiconductor chips to lead frames. For replacing the Pb-based solder, joining technique using the evaporated Ag/Cu/Sn films were developed. In this study, properties of intermetallic compound (IMC) joint made from the evaporated Ag/Cu/Sn films were investigated. The IMC joint consisting of Cu6Sn5, (Ag, Cu)3Sn and Cu3Sn layers was formed under heat treatment at 573 K for 30s. The IMC joint showed sufficient strength at 543 K to hold Si chip on Cu substrate. The high-temperature strength kept even after aging at 423 K for 3.6 Ms, although some voids were formed in the microstructure of IMC joint aged. The results of nanoindentation test indicate that excessive growth of Cu 3Sn would be undesirable for joint reliability.

本文言語English
ホスト出版物のタイトルMaterials Research Society Symposium Proceedings - Materials and Devices for Smart Systems III
ページ335-340
ページ数6
1129
出版ステータスPublished - 2009 11 20
外部発表はい
イベントMaterials and Devices for Smart Systems III - 2008 MRS Fall Meeting - Boston, MA, United States
継続期間: 2008 12 12008 12 4

Other

OtherMaterials and Devices for Smart Systems III - 2008 MRS Fall Meeting
国/地域United States
CityBoston, MA
Period08/12/108/12/4

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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