Progress of Yoroi-Coil Structure in Mechanical Strength with High Current Density

Tomonori Watanabe, Shigeo Nagaya, Naoki Hirano, Satoshi Awaji, Hidetoshi Oguro, Atsushi Ishiyama, Masaki Hojo, Masaaki Nishikawa

研究成果: Article査読

2 被引用数 (Scopus)


Yoroi-coil (Y-based oxide superconductor and reinforcing outer integrated coil) structure has been developed to fabricate very strong pancake coils against electromagnetic force. In Yoroi-coil structure, the outer supporting structure is effective to make a mechanically robust coil having a high current density in the case that the hoop stress must exceed the yield strength of a REBCO-coated conductor without this reinforcement. By the experiments and analysis, we pointed out that the remarkably weak delamination stress can cause the delamination of the coated conductor in coils. So that Yoroi-coil structure has advantages to delamination because it could maintain a coil shape with reinforcing materials, without impregnation. Since higher current density is required by various applications, the Yoroi-coil using austenitic stainless steel reinforcing frames and plates, has been verified by the hoop stress test with high current density. Then, high coil current density of 446 A/mm2 was achieved by the Yoroi-coil-structured double pancake (DP) coil, with the total number of the winding turns of 574, at 4.2 K in the back-up magnetic field of 11 T. The inner and outer diameters of the DP coil were 190 and 250.1 mm, respectively. Although the hoop stress evaluated on the assumption of excluding the supporting structure exceeds 1 GPa, Yoroi-coil structure restricted the strain of coil winding ranging 0.2% to 0.3%. The stainless steel reinforcing member well supported a part of electromagnetic force in Yoroi-coil structure, even with high coil current density.

ジャーナルIEEE Transactions on Applied Superconductivity
出版ステータスPublished - 2017 6

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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