Process Integration for FlexTrate TM

Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

We fabricate FlexTrate TM that is highly integrated bendable and/or rollable electronic systems in which various Si and/or III-V chips are embedded in elastomers and interconnected at the wafer level. This paper describes the process integration of the FlexTrate TM using massively parallel capillary self-assembly and a new single stress buffer layer technologies to form fine-pitch interconnection between the embedded neighboring chips and characterize the electrical/mechanical properties.

本文言語English
ホスト出版物のタイトル2018 International Flexible Electronics Technology Conference, IFETC 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781538633571
DOI
出版ステータスPublished - 2018 12 19
イベント2018 International Flexible Electronics Technology Conference, IFETC 2018 - Ottawa, Canada
継続期間: 2018 8 72018 8 9

出版物シリーズ

名前2018 International Flexible Electronics Technology Conference, IFETC 2018

Other

Other2018 International Flexible Electronics Technology Conference, IFETC 2018
CountryCanada
CityOttawa
Period18/8/718/8/9

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

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