Preparation of multilayered film of polyimide nanoparticles for low-K applications

Gufan Zhao, Takayuki Ishizaka, Hitoshi Kasai, Hidetoshi Oikawa, Hachiro Nakanishi

研究成果: Article査読

2 被引用数 (Scopus)

抄録

In order to reduce dielectric constant of polyimide, preparation of porous films assembled by polyimide nanoparticles was investigated. We utilized the electrophoretic deposition of polyimide nanoparticles to prepare porous low dielectric constant (low-k) films possessing voids between particles. The films thickness was controlled in the range of 500nm5m by changing the dispersion concentration and applied voltage. Porous morphologies were confirmed by SEM observation. As a result, dielectric constant of the film decreased to 2.32, 14% lower than that of the bulk polyimide film, due to the introduction of air voids into the matrix. This is the first report showing a promising approach with high processability for porous low-k polyimide films.

本文言語English
ページ(範囲)31/[613]-38/[620]
ジャーナルMolecular crystals and liquid crystals
464
1
DOI
出版ステータスPublished - 2006 3月
外部発表はい

ASJC Scopus subject areas

  • 化学 (全般)
  • 材料科学(全般)
  • 凝縮系物理学

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