Possibility of Cu-Mn alloy for TFT gate electrodes

Junichi Koike, K. Neishi, J. Iijima, Yuji Suto

研究成果: Paper査読

5 被引用数 (Scopus)

抄録

Cu-Mn alloy was deposited on SiO2 or on glass substrates. After heat treatment, the alloy film showed resistivity decrease to the level of pure Cu, together with good adhesion and diffusion barrier property with the substrates. Ohmic contact was also obtained for ITO/Cu-Mn film both before and after heat treatment.

本文言語English
ページ2037-2040
ページ数4
出版ステータスPublished - 2007 12 1
イベント14th International Display Workshops, IDW '07 - Sapporo, Japan
継続期間: 2007 12 52007 12 5

Other

Other14th International Display Workshops, IDW '07
CountryJapan
CitySapporo
Period07/12/507/12/5

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Radiology Nuclear Medicine and imaging
  • Atomic and Molecular Physics, and Optics

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