Pb-free solders: Part II. Application of ADAMIS database in modeling of Sn-Ag-Cu alloys with Bi additions

Ikuo Ohnuma, K. Ishida, Z. Moser, W. Ga̧sior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek

研究成果: Article査読

13 被引用数 (Scopus)

抄録

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn-Ag-Cu-Bi liquid alloys by Butler's model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn-Ag-Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-0.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to traditional Sn-Pb solders. The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.

本文言語English
ページ(範囲)245-254
ページ数10
ジャーナルJournal of Phase Equilibria and Diffusion
27
3
DOI
出版ステータスPublished - 2006 6 1

ASJC Scopus subject areas

  • 凝縮系物理学
  • 金属および合金
  • 材料化学

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