Packaged micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include laser assisted silicon etching and anodic bonding which enables to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum.
|出版ステータス||Published - 1994 12月 1|
|イベント||Proceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation - Tokyo, Jpn|
継続期間: 1994 11月 6 → 1994 11月 10
|Other||Proceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation|
|Period||94/11/6 → 94/11/10|
ASJC Scopus subject areas