Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

B. Wang, S. Tanaka, B. Guo, G. Vereecke, S. Severi, A. Witvrouw, M. Wevers, I. De Wolf

研究成果: Conference contribution

抄録

MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing. This paper reports on a systematical study of the outgassing properties of typical materials (Table 1) used for imec's polycrystalline silicon-germanium (poly-SiGe) based MEMS thin film vacuum package technology.

本文言語English
ホスト出版物のタイトル2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
DOI
出版ステータスPublished - 2012
イベント2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 - Singapore, Singapore
継続期間: 2012 7月 22012 7月 6

出版物シリーズ

名前Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
国/地域Singapore
CitySingapore
Period12/7/212/7/6

ASJC Scopus subject areas

  • 電子工学および電気工学

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