Origin and sedimentation of Cu-droplets sticking to spinel solids in pyrometallurgical slags

E. De Wilde, I. Bellemans, L. Zheng, M. Campforts, M. Guo, B. Blanpain, N. Moelans, K. Verbeken

研究成果: Article査読

25 被引用数 (Scopus)

抄録

Cu-droplet losses in slags are an important problem in Cu-industry, limiting the metal recovery. An important cause responsible for the entrainment of copper droplet losses in slags is their sticking behaviour to spinel solids. In the present study, the interaction between spinel solids and Cu-droplets is investigated in an industrially relevant slag system (PbO–CaO–SiO2–Cu2O–Al2O3–FeO–ZnO) using two complementary experimental set-ups. Firstly the influence of the sedimentation time is studied and secondly the presence of entrained (sticking) droplets is studied as a function of height in the slag layer. Based on the experimental results, a mechanism that explains the sticking Cu-droplets is proposed. Finally, a model describing the sedimentation of sticking and non-sticking droplets is formulated based on the experimental data.

本文言語English
ページ(範囲)1911-1924
ページ数14
ジャーナルMaterials Science and Technology (United Kingdom)
32
18
DOI
出版ステータスPublished - 2016 12月 11

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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