Optimizing pad groove design and polishing kinematics for reduced shear force, low force fluctuation and optimum removal rate attributes of copper CMP

Yasa Sampurno, Ara Philipossian, Sian Theng, Takenao Nemoto, Xun Gu, Yun Zhuang, Akinobu Teramoto, Tadahiro Ohmi

研究成果: Conference contribution

フィンガープリント

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Chemical Compounds

Physics & Astronomy

Engineering & Materials Science