Optimization of vertical interconnection in 3D LSI using wire-length distribution

T. Nakamura, Y. Yamada, T. Ono, J. C. Shim, H. Kurino, M. Koyanagi

研究成果: Conference article査読

2 被引用数 (Scopus)


In this paper, the model for wire length distribution model in three dimensional LSI is derived using Rent's rule. The number of the vertical interconnections and the ratio in all of wirings can be calculated with this model. This model clearly shows that many vertical interconnections are effectively utilized in chips with high Rent's constant p. We also evaluate the vertical interconnection density and the occupied area by the vertical interconnection in a chip.

ジャーナルAdvanced Metallization Conference (AMC)
出版ステータスPublished - 2003
イベントAdvanced Metallization Conference 2003, AMC 2003 - Montreal, Que., Canada
継続期間: 2003 10月 212003 10月 23

ASJC Scopus subject areas

  • 化学工学(全般)


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