On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

J. Yan, M. Yoshino, T. Kuriagawa, T. Shirakashi, K. Syoji, R. Komanduri

研究成果: Article査読

161 被引用数 (Scopus)

抄録

The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40°) and a high side cutting edge angle (SCEA) (approximately 88°) and undeformed chip thickness in the nanometric range (approximately 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (approximately 400 MPa) apparatus.

本文言語English
ページ(範囲)230-234
ページ数5
ジャーナルMaterials Science and Engineering A
297
1-2
DOI
出版ステータスPublished - 2001 1 15

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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