Novel sputtering process to reduce the grain size and its distribution in Co based longitudinal thin film media - new seedlayer and high KU GRAIN material-

Migaku Takahashi, Hiroki Shoji, D. D. Djayaprawira, Satoru Yoshimura

    研究成果: Conference article査読

    抄録

    This study is aimed at reducing the grain size and its distribution in Co-based longitudinal film media using the UC process as infrastructure. Proposed are two kinds of techniques. The first is the use of Co co-precipitated NiP/Al-alloy substrate (Co-NiP substrate). To reduce the grain size of Cr underlayer grown onto the substrate surface, oxygen exposure is introduced to increase the density of nucleation sites. The second is the use of a very thin W54Cr46 alloy seedlayer combined with dry-etching process. In this concept, the island-like structure at the initial layer is enhanced using a material with high melting point such as W. These techniques are expected to be useful in controlling the density of the nucleation sites of the initial film layer.

    本文言語English
    ジャーナルDigests of the Intermag Conference
    出版ステータスPublished - 2000 1月 1
    イベント2000 IEEE International Magnetics Conference-2000 IEEE INTERMAG - Toronto, Ont, Can
    継続期間: 2000 4月 92000 4月 13

    ASJC Scopus subject areas

    • 電子工学および電気工学

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