Novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration

K. W. Lee, C. Nagai, J. C. Bea, T. Fukushima, R. Suresh, X. Wu, T. Tanaka, M. Koyanagi

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

In order to solve the critical issues of current standard chip-to-wafer (C2W)/wafer-to-wafer (W2W) hybrid bonding technologies, we propose novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using three types of scaled tiny electrodes with slightly extruded structure and unique adhesive layers for ultra-high density 2.5D/3D integration applications. Especially, we developed a high stacking yield hybrid bonding technology using unique anisotropic conductive film composed of ultra-high density nano-Cu filaments for exascale 2.5D/3D integration. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um by chip self-assembly method and thermal-compression bonding in wafer-level. Totally 3,898,000 of 4,309,200 electrodes with 3um diameter/6um pitch in each TEG chip are well intact-bonded by new hybrid bonding technology using ultra-high density nano-Cu filaments which gives rise to the joining yield of 90%.

本文言語English
ホスト出版物のタイトル2015 IEEE International Electron Devices Meeting, IEDM 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ8.2.1-8.2.4
ISBN(電子版)9781467398930
DOI
出版ステータスPublished - 2015 2 16
イベント61st IEEE International Electron Devices Meeting, IEDM 2015 - Washington, United States
継続期間: 2015 12 72015 12 9

出版物シリーズ

名前Technical Digest - International Electron Devices Meeting, IEDM
2016-February
ISSN(印刷版)0163-1918

Other

Other61st IEEE International Electron Devices Meeting, IEDM 2015
国/地域United States
CityWashington
Period15/12/715/12/9

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

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