Aluminum nitride (AlN), with its high thermal conductivity, high electrical resistivity and close thermal expansion match to silicon, has attained wide use. Some representative examples arc electronic substrates, heat sinks, cutting tools and refractory materials, One of its drawbacks, however, is the vulnerability to chemical attacks. The theoretically excellent properties of AlN are significantly suppressed by reactions with water or water vapor and chemical corrosions with an alkaline solution. These shortcomings have been remedied by the present invention: a novel surface treatment process to form a chemically stable and mechanically strong alumina layer on AlN. This innovative process has been developed on the basis of the high-temperature oxidation behavior of AlN, and expands the potential applications of AlN, A Cu post-fired metallization process has been developed associated with the surface-treated substrate, The Cu post-fired metallization substrate has excellent adhesion strength and sufficient reliability.
|出版ステータス||Published - 2006 7 24|
|イベント||6th Pacific Rim Conference on Ceramic and Glass Technology, PacRim6 - Maui, HI, United States|
継続期間: 2005 9 11 → 2005 9 16
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