Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

Yuki Ohara, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm 2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

元の言語English
ホスト出版物のタイトル2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOI
出版物ステータスPublished - 2011 12 1
イベント2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
継続期間: 2012 1 312012 2 2

出版物シリーズ

名前2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Japan
Osaka
期間12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

フィンガープリント Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Ohara, Y., Ri, K., Fukushima, T., Tanaka, T., & Koyanagi, M. (2011). Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. : 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6262950] (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6262950