Nondestructive evaluation of elastic properties in porous silicon film on Si(100) by the phase velocity scanning of laser interference fringes

H. Cho, H. Sato, H. Nishino, Y. Tsukahara, M. Inaba, A. Sato, M. Takemoto, S. Nakano, K. Yamanaka

研究成果: Conference article査読

10 被引用数 (Scopus)

抄録

Accounting an attractive application of porous silicon (PS) film as a micromachine jointing layer, we evaluated elastic properties of the PS film by the analysis of velocity dispersion of surface acoustic waves (SAW). We developed a novel laser ultrasonic method which utilized the laser interference fringes scanned at the phase velocity of the SAW and measured, for the first time, SAW velocity dispersion of the PS film in dry condition. The phase velocity of the SAW of the PS film was found to decrease with an increase of the porosity. Curve fitting of the measured dispersion to the computed one gave extremely small elastic stiffness of the PS film compared to that of Si wafer. Morphology of pores in the PS film, estimated from a relationship between the porosity and elastic stiffness C44, was found to be ordered and less open structure.

本文言語English
ページ(範囲)757-760
ページ数4
ジャーナルProceedings of the IEEE Ultrasonics Symposium
1
出版ステータスPublished - 1995
イベントProceedings of the 1995 IEEE Ultrasonics Symposium. Part 1 (of 2) - Seattle, WA, USA
継続期間: 1995 11 71995 11 10

ASJC Scopus subject areas

  • 音響学および超音波学

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