Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

The effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC, which has a stacked structure of digital and analog IC chips. The noise propagation through the TSV was measured with a ring-oscillator as a noise source. To investigate in detail, TSV-liner interface states were evaluated along depth direction using unique multi-well-structured TSVs and charge-pumping method. It was considered that the interface traps and non-conformal thickness of TSV liner increased the noise propagation among stacked chips.

本文言語English
ホスト出版物のタイトル2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ222-224
ページ数3
ISBN(電子版)9781538665084
DOI
出版ステータスPublished - 2019 3
イベント2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore
継続期間: 2019 3 122019 3 15

出版物シリーズ

名前2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Conference

Conference2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
国/地域Singapore
CitySingapore
Period19/3/1219/3/15

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • ハードウェアとアーキテクチャ

フィンガープリント

「Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル