Nickel-stabilized nanoporous copper fabricated from ternary TiCuNi amorphous alloys

Zhenhua Dan, Fengxiang Qin, Yu Sugawara, Izumi Muto, Akihiro Makino, Nobuyoshi Hara

研究成果: Article査読

20 被引用数 (Scopus)

抄録

Minor additive nickel (1 at%) to Ti-Cu amorphous alloy helped to form the finer nanoporous copper (NPC). The pore size of open-cell nanoporous fcc Cu was confirmed to be 71 nm for Ti60Cu40 alloy and 23 nm for Ti60Cu39Ni1 alloy after immersion of 43.2 ks in 0.03 M HF solution at 298 K. The pore size increased with immersion time in a form of the power law function with an exponent of 0.26. The estimated surface diffusivity decreased by about two orders of magnitude from 2.5×10 -18 to 2.7×10-20 m2 s-1by adding 1 at% Ni to Ti60Cu40 ribbons. The activation energy of surface diffusion of Cu atoms was estimated to be 68 kJ mol-1. The refinement of nanoporous Cu was resulted from the additive Ni with one-order lower surface diffusivity than Cu. Ni adatoms acted as a barrier for the diffusion and rearrangement of Cu adatoms, as a result, the smaller nanopores formed on Ti-Cu-Ni amorphous alloy.

本文言語English
ページ(範囲)128-131
ページ数4
ジャーナルMaterials Letters
94
DOI
出版ステータスPublished - 2013

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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