Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175°C continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.