Next-gen IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation

Hiromichi Gohara, Yoshitaka Nishimura, Akira Morozumi, Peter Dietrich, Eiji Mochi Zuki, Yoshikazu Takahashi

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175°C continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.

本文言語English
ホスト出版物のタイトルProceedings - PCIM Europe 2014
ホスト出版物のサブタイトルInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
出版社Mesago PCIM GmbH
ページ1187-1194
ページ数8
ISBN(印刷版)9783800736034
出版ステータスPublished - 2014 1 1
外部発表はい
イベントInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2014 - Nuremberg, Germany
継続期間: 2014 5 202014 5 22

出版物シリーズ

名前PCIM Europe Conference Proceedings
ISSN(電子版)2191-3358

Other

OtherInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2014
国/地域Germany
CityNuremberg
Period14/5/2014/5/22

ASJC Scopus subject areas

  • 電子工学および電気工学

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