抄録
In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer's attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy. Process of development, structure and cleaning technical characters will be described.
| 本文言語 | English |
|---|---|
| ホスト出版物のタイトル | IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings |
| 編集者 | Anon |
| 出版社 | IEEE |
| 出版ステータス | Published - 1997 |
| イベント | Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference - San Francisco, CA, USA 継続期間: 1997 10月 6 → 1997 10月 8 |
Other
| Other | Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference |
|---|---|
| City | San Francisco, CA, USA |
| Period | 97/10/6 → 97/10/8 |
ASJC Scopus subject areas
- 電子工学および電気工学
- 産業および生産工学