New measurement concept of nanometer-level defects on Si wafer surface by using micro contact sensor

Wenjian Lu, Shimizu Yuki, Gao Wei

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

A thermal-type contact sensor was proposed to detect small defects, the heights of which are less than 16 nm, on the wafer surface. The feasibility of the contact sensor, which detects frictional heat generated at the contact, was theoretically investigated focusing on the temperature rise of the sensor element. Simulation results with both the simple model of heat transfer and the FEM model showed that the expected temperature rise of the contact sensor is enough to be detected by the conventional electric circuit.

本文言語English
ホスト出版物のタイトルUltra-Precision Machining Technologies
ページ137-141
ページ数5
DOI
出版ステータスPublished - 2012
外部発表はい
イベント8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011 - Hangzhou City, China
継続期間: 2011 11 202011 11 22

出版物シリーズ

名前Advanced Materials Research
497
ISSN(印刷版)1022-6680

Other

Other8th CHINA-JAPAN International Conference on Ultra-Precision Machining, CJUPM 2011
国/地域China
CityHangzhou City
Period11/11/2011/11/22

ASJC Scopus subject areas

  • 工学(全般)

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