New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages

M. Sugimura, H. Imai, M. Kawasaki, K. Kamata, K. Fujii, Y. Fujito, S. Yonehara, Akinobu Teramoto, Shigetoshi Sugawa, T. Ohmi

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

From recent technological backgrounds, packaging materials for semiconductor applications play a significant role in increased number of pins for grid array, miniaturization, high transmission performance and high reliability. In order to achieve such requirement, we have developed an insulation material for build-up layer package with four outstanding properties; high adhesivity between Cu line and substrate with flat surface, extremely low water absorption, low expansion coefficient, and low dielectric constant with low dielectric loss. We made a technological breakmrough for the Cu line formation onto a quite smooth substrate surface, showing that 10μm/10μm pattern in line and space can be formed finely by using a semi-additive method. Insulation reliability tests for the developed material were studied. The developed material show significantly better reliability than that of existing epoxy based material. We also studied high frequency signal propagation properties of the developed material. The developed material realizes substantial reduction of high frequency propagation loss from existing material. We concluded those technological development can contribute to the semiconductor packaging technology trend toward high density, high speed with high reliability.

本文言語English
ホスト出版物のタイトル2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
ページ747-752
ページ数6
DOI
出版ステータスPublished - 2008 9 15
イベント2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
継続期間: 2008 5 272008 5 30

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Other

Other2008 58th Electronic Components and Technology Conference, ECTC
国/地域United States
CityLake Buena Vista, FL
Period08/5/2708/5/30

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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