New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kanuku Ri, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A new TSV formation methodology based on advanced Directed Self-Assembly (DSA) with nanocomposites consisting of nano metal particles and block-co-polymers is proposed in this paper. Cylindrical nano-ordered structures are formed in Si deep holes through phase separation of polystyrene-block-poly methyl methacrylate polymers (PS-b-PMMA). The impact of molecular weight of the polymers, composition (PS/PMMA ratio), and phase separation temperature on the morphologies is discussed. In addition, simulation results using Self-Consistent Field (SCF) theory are introduced to make fine-pitch TSV.

本文言語English
ホスト出版物のタイトル2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781509013999
DOI
出版ステータスPublished - 2017 7 5
イベント2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 - San Francisco, United States
継続期間: 2016 11 82016 11 11

出版物シリーズ

名前2016 IEEE International 3D Systems Integration Conference, 3DIC 2016

Other

Other2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
CountryUnited States
CitySan Francisco
Period16/11/816/11/11

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications

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