New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Takafumi Fukushima; Mariappan Murugesan; Shin Ohsaki; Hiroyuki Hashimoto; Jichoel Bea; Kanuku Ri; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/3DIC.2016.7970022

New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kanuku Ri, Tetsu Tanaka, Mitsumasa Koyanagi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A new TSV formation methodology based on advanced Directed Self-Assembly (DSA) with nanocomposites consisting of nano metal particles and block-co-polymers is proposed in this paper. Cylindrical nano-ordered structures are formed in Si deep holes through phase separation of polystyrene-block-poly methyl methacrylate polymers (PS-b-PMMA). The impact of molecular weight of the polymers, composition (PS/PMMA ratio), and phase separation temperature on the morphologies is discussed. In addition, simulation results using Self-Consistent Field (SCF) theory are introduced to make fine-pitch TSV.

本文言語	English
ホスト出版物のタイトル	2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子版）	9781509013999
DOI	https://doi.org/10.1109/3DIC.2016.7970022
出版ステータス	Published - 2017 7 5
イベント	2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 - San Francisco, United States 継続期間: 2016 11 8 → 2016 11 11

出版物シリーズ

名前	2016 IEEE International 3D Systems Integration Conference, 3DIC 2016

Other

Other	2016 IEEE International 3D Systems Integration Conference, 3DIC 2016
Country	United States
City	San Francisco
Period	16/11/8 → 16/11/11

ASJC Scopus subject areas

Hardware and Architecture
Electronic, Optical and Magnetic Materials
Computer Networks and Communications

文献へのアクセス

10.1109/3DIC.2016.7970022

フィンガープリント「New concept of TSV formation methodology using Directed Self-Assembly (DSA)」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Fukushima, T., Murugesan, M., Ohsaki, S., Hashimoto, H., Bea, J., Ri, K., Tanaka, T., & Koyanagi, M. (2017). New concept of TSV formation methodology using Directed Self-Assembly (DSA). In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016 [7970022] (2016 IEEE International 3D Systems Integration Conference, 3DIC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC.2016.7970022

New concept of TSV formation methodology using Directed Self-Assembly (DSA). / Fukushima, Takafumi; Murugesan, Mariappan; Ohsaki, Shin; Hashimoto, Hiroyuki; Bea, Jichoel; Ri, Kanuku; Tanaka, Tetsu; Koyanagi, Mitsumasa.

2016 IEEE International 3D Systems Integration Conference, 3DIC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. 7970022 (2016 IEEE International 3D Systems Integration Conference, 3DIC 2016).

研究成果: Conference contribution

Fukushima, T, Murugesan, M, Ohsaki, S, Hashimoto, H, Bea, J, Ri, K, Tanaka, T & Koyanagi, M 2017, New concept of TSV formation methodology using Directed Self-Assembly (DSA). in 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016., 7970022, 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, United States, 16/11/8. https://doi.org/10.1109/3DIC.2016.7970022

Fukushima T, Murugesan M, Ohsaki S, Hashimoto H, Bea J, Ri K et al. New concept of TSV formation methodology using Directed Self-Assembly (DSA). In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016. Institute of Electrical and Electronics Engineers Inc. 2017. 7970022. (2016 IEEE International 3D Systems Integration Conference, 3DIC 2016). https://doi.org/10.1109/3DIC.2016.7970022

Fukushima, Takafumi ; Murugesan, Mariappan ; Ohsaki, Shin ; Hashimoto, Hiroyuki ; Bea, Jichoel ; Ri, Kanuku ; Tanaka, Tetsu ; Koyanagi, Mitsumasa. / New concept of TSV formation methodology using Directed Self-Assembly (DSA). 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. (2016 IEEE International 3D Systems Integration Conference, 3DIC 2016).

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