A neuromorphic vision chip with three dimesional structure was fabricated using three dimensional integration technology. The device wafer with buried interconnections was glued to the quartz glass and then thinned from the backside using mechanical grinding and chemical mechanical polishing (CMP). On the bottom of the buried interconnections on the backside, micro bumps were formed. The thinned wafer was glued to another wafer. The three dimensional stacked wafer was obtained by repeating this sequence.
|ジャーナル||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|出版ステータス||Published - 2001|
|イベント||Digest of Technical Papers - IEEE International Solid-State Circuits Conference - |
継続期間: 2001 2月 5 → 2001 2月 6
ASJC Scopus subject areas