Nanoparticulated dense and stress-free ceramic thick film for material integration

Yoshihiko Imanaka; Hideyuki Amada; Fumiaki Kumasaka; Norihiko Takahashi; Takahiro Yamasaki; Mari Ohfuchi; Chioko Kaneta

doi:10.1002/adem.201300174

Nanoparticulated dense and stress-free ceramic thick film for material integration

Yoshihiko Imanaka, Hideyuki Amada, Fumiaki Kumasaka, Norihiko Takahashi, Takahiro Yamasaki, Mari Ohfuchi, Chioko Kaneta

研究成果: Article › 査読

11 被引用数 (Scopus)

抄録

A dense, thick, and organic-binder-free ceramic film consisting of stress-free nanoparticles could be obtained at room temperature by making use of the unstable and high-surface energy amorphous phase on the surface of particles. Photolithography and wet etching can be adapted to the thick ceramic green-state film. A multilayered structure consisting of various ceramics with different sintering temperatures and Cu wiring can form on a Cu foil below 1000 °C.

本文言語	English
ページ（範囲）	1129-1135
ページ数	7
ジャーナル	Advanced Engineering Materials
巻	15
号	11
DOI	https://doi.org/10.1002/adem.201300174
出版ステータス	Published - 2013 11 1
外部発表	はい

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

文献へのアクセス

10.1002/adem.201300174

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引用スタイル

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AU - Ohfuchi, Mari

AU - Kaneta, Chioko

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