Nano-microscale moulding of some metal plates with high strength Ni-W alloy moulds

Tohru Yamasaki, Masahiro Yamada, Hiroki Adachi, Takayuki Nabeshima, Yoshihiko Yokoyama

研究成果: Article査読

3 被引用数 (Scopus)

抄録

High strength nanocrystalline and amorphous Ni-14-24 at. % W alloys with their tensile strengths of about 3 GPa have been prepared by electrodeposition. Nano-microscale Ni-W alloy mould inserts, consisting of line and space structures with the line-widths of 700 and 300 nm and the height of 200 nm, were fabricated. High compression stress moulding of some metal plates of pure-Al, SUS-316L stainless steel and Zr69Cu16Ni5Al10bulk metallic glass with the Ni-W alloy inserts was carried out at room temperature. In the case of the pure-Al under moulding stress of about 350 MPa, full moulding was achieved with the depths of about 200 nm approximately equal to the height of the inserts. Repeat moulding of 200 cycles did not cause any noticeable change or degradation of the Ni-W alloy inserts. In the case of the SUS-316L stainless steel under the moulding stress of about 1 GPa, however, the nano-microscale moulding was not achieved. This may be due to the high strain hardening ability of the SUS-316L stainless steel during plastic deformation. In the case of the Zr69Cu16Ni5Al10bulk metallic glass with a high yielding stress of about 1.5 GPa and no strain hardening ability, full moulding was almost achieved successfully under the high moulding stress of about 2 GPa.

本文言語English
ページ(範囲)1941-1948
ページ数8
ジャーナルMicrosystem Technologies
20
10-11
DOI
出版ステータスPublished - 2014 10 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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