Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki; Y. Muroya; J. Sasaki; H. Yamada; T. Torikai

Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki, Y. Muroya, J. Sasaki, H. Yamada, T. Torikai

研究成果: Conference article › 査読

抄録

Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

本文言語	English
ページ（範囲）	212-215
ページ数	4
ジャーナル	IEE Conference Publication
号	448 /2
出版ステータス	Published - 1997 12月 1
外部発表	はい
イベント	Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) - 継続期間: 1997 9月 22 → 1997 9月 25

ASJC Scopus subject areas

電子工学および電気工学

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引用スタイル

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title = "Multiwavelength DFB-LD array module using self-aligned solder bump bonding",

abstract = "Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.",

author = "N. Suzuki and Y. Muroya and J. Sasaki and H. Yamada and T. Torikai",

year = "1997",

month = dec,

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language = "English",

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journal = "IEE Conference Publication",

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number = "448 /2",

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T1 - Multiwavelength DFB-LD array module using self-aligned solder bump bonding

AU - Suzuki, N.

AU - Muroya, Y.

AU - Sasaki, J.

AU - Yamada, H.

AU - Torikai, T.

PY - 1997/12/1

Y1 - 1997/12/1

N2 - Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

AB - Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

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M3 - Conference article

AN - SCOPUS:0031333064

SP - 212

EP - 215

JO - IEE Conference Publication

JF - IEE Conference Publication

SN - 0537-9989

IS - 448 /2

T2 - Proceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5)

Y2 - 22 September 1997 through 25 September 1997

ER -

Multiwavelength DFB-LD array module using self-aligned solder bump bonding

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ASJC Scopus subject areas

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