TY - GEN
T1 - Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly
AU - Fukushima, Takafumi
N1 - Funding Information:
This work was performed in the Micro/Nano-machining research and education Center (MNC), Jun-ichi Nishizawa Research Center, and Global INTegration Initiative (GINTI) in Tohoku University.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/4
Y1 - 2020/4
N2 - We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.
AB - We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.
KW - 3D integration
KW - FHE
KW - heterogeneous integration
KW - massively parallel capillary self-assembly
KW - micro-LED
KW - multichip-to-wafer bonding
UR - http://www.scopus.com/inward/record.url?scp=85091971465&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85091971465&partnerID=8YFLogxK
U2 - 10.1109/EDTM47692.2020.9117867
DO - 10.1109/EDTM47692.2020.9117867
M3 - Conference contribution
AN - SCOPUS:85091971465
T3 - 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
BT - 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020
Y2 - 6 April 2020 through 21 April 2020
ER -