Miniaturized silicon capacitive accelerometer for downhole seismic measurement

H. Asanuma, M. Nishizawa, G. Suzuki, Y. Yoshida, H. Niitsuma, M. Esashi

研究成果: Conference contribution


Microsensors have a potential to drastically improve subsurface measurement, because they have advantages in cost, installation, mobility and sensitivity to the conventional sensors. The authors have been developping a silicon capacitive micro accelerometer for downhole seismic detector under "Subsurface Microsensing Project" in Tohoku University, Japan. In this paper, the concept, design, packaging and field test of this seismic detector with microsensor is described. The micro accelerometer is fabricated using silicon and glass, and has a size of 9mm×5mm×2.2mm. The sensor has comparable sensitivity and frequency characteristics to high sensitive piezoelectric accelerometers. Three sensors are mounted on a circuit board and assembled in a sonde which protects the sensor/circuit from water in borehole. In situ detectability of seismic wave was evaluated in a small test field using artificial seismic source.

ホスト出版物のタイトルAdvances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
出版ステータスPublished - 2001 12 1
イベントAdvances in Electronic Packaging - Kauai, Hi, United States
継続期間: 2001 7 82001 7 13


名前Advances in Electronic Packaging


OtherAdvances in Electronic Packaging
国/地域United States
CityKauai, Hi

ASJC Scopus subject areas

  • 工学(全般)
  • 電子工学および電気工学


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