Microwave imaging of conductivity distribution of silicon wafers

Yang Ju, Masumi Saka, Hiroyuki Abé

研究成果: Conference contribution

抄録

Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.

本文言語English
ホスト出版物のタイトルAdvances in Electronic Packaging 2003
ホスト出版物のサブタイトルVolume 1
出版社American Society of Mechanical Engineers
ページ61-64
ページ数4
ISBN(印刷版)0791836908, 9780791836903
DOI
出版ステータスPublished - 2003 1 1
イベント2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
継続期間: 2003 7 62003 7 11

出版物シリーズ

名前Advances in Electronic Packaging
1

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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