Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys

J. J. Wang, T. Omori, Y. Sutou, R. Kainuma, K. Ishida

研究成果: Article査読

10 被引用数 (Scopus)

抄録

The effects of grain size, volume fraction of the α (fcc) phase in the β(bcc) matrix, and thermal stability on low thermal expansion (LTE) properties of Cu-Zn-Al shape memory (SM) alloys induced by cold rolling were investigated by dilatometry, optical microscopy, differential scanning calorimetry, and electrical conductivity measurements. The alloys with the larger grains showed a superior two-way memory (TWM) effect, wider LTE temperature intervals with excellent thermal stability under 80°C. The α + β two-phase alloys also exhibited a good combination of cold workability and LTE properties. These results suggest that the Cu-Zn-Al alloys with high electrical conductivity of about 20% International Annealed Copper Standard (%IACS) have high potential as a new class of Invar alloys that can be applied in various fields.

本文言語English
ページ(範囲)1098-1102
ページ数5
ジャーナルJournal of Electronic Materials
33
10
DOI
出版ステータスPublished - 2004 10

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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