Microstructural analysis of damaged layer introduced during chemo-mechanical polishing

Hideki Sako, Tamotsu Yamashita, Kentaro Tamura, Masayuki Sasaki, Masatake Nagaya, Takanori Kido, Kenji Kawata, Tomohisa Kato, Kazutoshi Kojima, Susumu Tsukimoto, Hirofumi Matsuhata, Makoto Kitabatake

    研究成果: Conference contribution

    14 被引用数 (Scopus)

    抄録

    Damaged layers, which are introduced during chemo-mechanical polishing (CMP) underneath the 4°off-cut 4H-SiC wafer surface and cause surface defects formations after epitaxial films growth, are investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). SEM observations show presence of small scratches on wafer surfaces after CMP process. The widths of such scratches are submicron meters, thus it is hard to detect them by optical microscopy. TEM observations show that high-density regions of dislocation loops exist below scratches and the widths of such dislocation loops are much wider than the morphological width. Details of the dislocation structure are also analyzed. It is shown that the high-density dislocation loops cause local surface roughening on the surface of the epitaxial film.

    本文言語English
    ホスト出版物のタイトルSilicon Carbide and Related Materials 2013
    編集者Hajime Okumura, Hajime Okumura, Hiroshi Harima, Tsunenobu Kimoto, Masahiro Yoshimoto, Heiji Watanabe, Tomoaki Hatayama, Hideharu Matsuura, Yasuhisa Sano, Tsuyoshi Funaki
    出版社Trans Tech Publications Ltd
    ページ370-373
    ページ数4
    ISBN(印刷版)9783038350101
    DOI
    出版ステータスPublished - 2014
    イベント15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013 - Miyazaki, Japan
    継続期間: 2013 9 292013 10 4

    出版物シリーズ

    名前Materials Science Forum
    778-780
    ISSN(印刷版)0255-5476
    ISSN(電子版)1662-9752

    Other

    Other15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013
    CountryJapan
    CityMiyazaki
    Period13/9/2913/10/4

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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