Microscale adhesion strength evaluation of cold sprayed copper deposit

Y. Ichikawa, R. Tokoro, K. Ogawa

研究成果: Conference contribution

抄録

Adhesion strength is one of the most important characteristics when discussing the reliability of a cold spray. A focused ion beam (FIB) was used to conduct ultra-micro tensile tests for micro-scale adhesive strength evaluations of high-pressure type cold-sprayed copper deposition on an aluminum substrate. It was also used to determine the essential factor of adhesion strength and the coating formation mechanism. The micro-scale local adhesion strength of cold-sprayed copper deposits on an aluminum substrate was successfully evaluated by FIB microtensile tests. The average local adhesion strength of this deposit was 223 MPa. The variations in adhesion strength between deposit and substrate were smaller than the interfacial strength of cold-sprayed deposits. This was caused by the repeated collision of these subsequent particles.

本文言語English
ホスト出版物のタイトルInternational Thermal Spray Conference and Exposition, ITSC 2017
出版社ASM International
ページ328-332
ページ数5
ISBN(電子版)9781510858220
出版ステータスPublished - 2017
イベントInternational Thermal Spray Conference and Exposition, ITSC 2017 - Dusseldorf, Germany
継続期間: 2017 6 72017 6 9

出版物シリーズ

名前Proceedings of the International Thermal Spray Conference
1

Other

OtherInternational Thermal Spray Conference and Exposition, ITSC 2017
CountryGermany
CityDusseldorf
Period17/6/717/6/9

ASJC Scopus subject areas

  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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