Microassembly of pzt actuators into silicon microstructures

Mohd Faizul Mohd Sabri, Takahito Ono, Masayoshi Esashi

研究成果: Article査読

5 被引用数 (Scopus)

抄録

This letter presents the fabrication process of a hybrid MEMS device, which integrates PZT (PbZrTiO3) actuators into a silicon microstructure. A microassembly technique which employs vertical well structures to allow precise positioning of MEMS devices onto a substrate, is demonstrated in this paper. The silicon microstructure is fabricated by deep reactive ion etching, and metal patterns are formed on it by photolithography using a thick photoresist. Ceramic PZT actuators are also fabricated using micro fabrication processes. The stacked PZT actuators are inserted into photoresist frame, and mechanically and electrically connected to the silicon structure using Ni electroplating. Using this method, the fabrication of micro XY-stage with Si-PZT hybrid structures is demonstrated. This technique is applicable to any number or combination of MEMS devices which require precise positioning onto a substrate, under micron-scale tolerances.

本文言語English
ページ(範囲)471-472
ページ数2
ジャーナルIEEJ Transactions on Sensors and Micromachines
129
12
DOI
出版ステータスPublished - 2009

ASJC Scopus subject areas

  • 機械工学
  • 電子工学および電気工学

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