Metallurgical and electrical characterization of ultrathin CoTix liner/barrier for Cu interconnects

Maryamsadat Hosseini, Junichi Koike

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

This paper reports an amorphous CoTix alloy as a single-layer liner/barrier material for intermediate interconnects in place of bilayer Ta/TaN materials. The CoTix layer was found to enhance adhesion of Cu/SiO2. The CoTix layer stayed amorphous after annealing at 400°C, and started to crystallize at 500°C. Capacitance-voltage measurement of the samples showed no interdiffusion of Cu ions into SiO2 after annealing up to 600°C and after bias thermal stress at 250°C at 3 MV/cm. All the obtained results showed that the amorphous CoTix alloy is a promising material for a liner/barrier layer in advanced technology node.

本文言語English
ホスト出版物のタイトルIITC 2017 - 2017 IEEE International Interconnect Technology Conference
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781509064731
DOI
出版ステータスPublished - 2017 7月 5
イベント2017 IEEE International Interconnect Technology Conference, IITC 2017 - Hsinchu, Taiwan, Province of China
継続期間: 2017 5月 162017 5月 18

出版物シリーズ

名前IITC 2017 - 2017 IEEE International Interconnect Technology Conference

Other

Other2017 IEEE International Interconnect Technology Conference, IITC 2017
国/地域Taiwan, Province of China
CityHsinchu
Period17/5/1617/5/18

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 金属および合金
  • 電子工学および電気工学

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