MEMS on LSI by adhesive bonding and wafer level packaging

Masayoshi Esashi, Shuji Tanaka

研究成果: Conference contribution

抄録

Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

本文言語English
ホスト出版物のタイトルHeterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
ページ38-49
ページ数12
DOI
出版ステータスPublished - 2012
イベント2012 MRS Spring Meeting - San Francisco, CA, United States
継続期間: 2012 4月 92012 4月 13

出版物シリーズ

名前Materials Research Society Symposium Proceedings
1427
ISSN(印刷版)0272-9172

Other

Other2012 MRS Spring Meeting
国/地域United States
CitySan Francisco, CA
Period12/4/912/4/13

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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