MEMS for practical application with attention to packaging

Masayoshi Esashi

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

MEMS (Micro Electro Mechanical Systems) has been studied for practical applications with attention to packaging. Wafer level packaged devices as integrated capacitive pressure sensor, MEMS relay and electrostatically levitated rotational gyroscope and arrayed MEMS as multi-probe data storage and multi-column electron beam lithography system have been developed. Electrical feedthroughs in glass play important roles in the wafer level packaging and the arrayed MEMS. Materials as diamond for recording probe and carbon nano tube for electron field emitter are utilized in the MEMS for their functionalities.

本文言語English
ホスト出版物のタイトル2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers
ページ11-14
ページ数4
DOI
出版ステータスPublished - 2006 12 1
イベント2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT - Taipei, Taiwan, Province of China
継続期間: 2006 10 182006 10 20

出版物シリーズ

名前2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers

Other

Other2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT
国/地域Taiwan, Province of China
CityTaipei
Period06/10/1806/10/20

ASJC Scopus subject areas

  • 電子工学および電気工学

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