MEMS-CMOS integrated tactile sensor with digital signal processing for robot application

M. Makihata, Masanori Muroyama, S. Tanaka, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, Masayoshi Esashi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

An ultra-small tactile sensor with functions of signal processing and digital communication has been prototyped based on MEMS-CMOS integration technology. The designed analog-digital mixed signal ASIC allows many tactile sensors to connect each other on a common bus line, which drastically reduces the number of wire. The ASIC capacitively detects the deformation of a force sensor and sends digital data to the common bus line when the force exceeds a threshold. The digital data contain a physical ID of each sensor, 32-bit sensing data and 16-bit cyclic redundancy check (CRC) code. In this study, a novel wafer-level integration and packaging technology were developed, and a chip-size-packaged tactile sensor with a small footprint (2.5mmx2.5mm) and a low profile (0.27mm) was prototyped and tested. The sensor autonomously sends digital data like a tactile receptor of human.

本文言語English
ホスト出版物のタイトルHeterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
ページ98-105
ページ数8
DOI
出版ステータスPublished - 2012
イベント2012 MRS Spring Meeting - San Francisco, CA, United States
継続期間: 2012 4月 92012 4月 13

出版物シリーズ

名前Materials Research Society Symposium Proceedings
1427
ISSN(印刷版)0272-9172

Other

Other2012 MRS Spring Meeting
国/地域United States
CitySan Francisco, CA
Period12/4/912/4/13

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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