TY - JOUR
T1 - Mechanism of electrical conduction through anisotropically conductive adhesive films
AU - Mizuno, Masuo
AU - Saka, Masumi
AU - Abé, Hiroyuki
PY - 1996/12
Y1 - 1996/12
N2 - Anisotropically conductive adhesive films (ACF's) which had different amount of electrically conductive particle contents and insulating particle contents were offered for measurement of electrical resistance between electrically conductive glass substrates and flexible printed circuits (FPC's) connected by using these ACF's. As a result, the electrical resistance for samples using ACF's containing electrically conductive particles was proved to be low, and also that for samples using ACF's containing insulating particles or no particles was proved to be considerably lower than we had expected. On the other hand, after high temperature and high humidity treatment or temperature cycle treatment, the electrical resistance for samples using ACF's containing electrically conductive particles did not change so much, but that for samples using ACF's containing insulating particles or no particles changed significantly, that is, it increased remarkably. From these facts, we presumed that there were two kinds of electric current passing through ACF's: one passing through electrically conductive particles and the other not passing through them; the current passing through electrically conductive particles did not change so much even after high temperature and high humidity treatment or temperature cycle treatment, but the current not passing through electrically conductive particles significantly reduced after the treatment mentioned above. On the basis of the above result, the role of conductive particles in ACF's was considered.
AB - Anisotropically conductive adhesive films (ACF's) which had different amount of electrically conductive particle contents and insulating particle contents were offered for measurement of electrical resistance between electrically conductive glass substrates and flexible printed circuits (FPC's) connected by using these ACF's. As a result, the electrical resistance for samples using ACF's containing electrically conductive particles was proved to be low, and also that for samples using ACF's containing insulating particles or no particles was proved to be considerably lower than we had expected. On the other hand, after high temperature and high humidity treatment or temperature cycle treatment, the electrical resistance for samples using ACF's containing electrically conductive particles did not change so much, but that for samples using ACF's containing insulating particles or no particles changed significantly, that is, it increased remarkably. From these facts, we presumed that there were two kinds of electric current passing through ACF's: one passing through electrically conductive particles and the other not passing through them; the current passing through electrically conductive particles did not change so much even after high temperature and high humidity treatment or temperature cycle treatment, but the current not passing through electrically conductive particles significantly reduced after the treatment mentioned above. On the basis of the above result, the role of conductive particles in ACF's was considered.
KW - Anisotropically conductive adhesive film
KW - Electrical resistance
KW - Electrically conductive particle
KW - High temperature and high humidity treatment
KW - Insulating particle
KW - Mechanism of electrical conduction
KW - Particle content
KW - Temperature cycle treatment
UR - http://www.scopus.com/inward/record.url?scp=0030406403&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0030406403&partnerID=8YFLogxK
U2 - 10.1109/95.554936
DO - 10.1109/95.554936
M3 - Article
AN - SCOPUS:0030406403
SN - 1070-9886
VL - 19
SP - 546
EP - 553
JO - IEEE Transactions on Components Packaging and Manufacturing Technology Part A
JF - IEEE Transactions on Components Packaging and Manufacturing Technology Part A
IS - 4
ER -