Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors

Ryota Mizuno, Genta Nakauchi, Ken Suzuki, Hideo Miura

研究成果: Conference contribution

抄録

In this study, micro-scale strain sensors were embedded in a silicon chip to measure the variation of the local stress distribution around thin film interconnections used for 3D semiconductor modules. Piezoresistive effect of single crystal silicon was applied to the sensors. The stress sensitivity at room temperature was 1.3 MPa/Ω. Even though the stress sensitivity varied as a strong function of temperature, it was confirmed that this sensor can measure the stress distribution quantitatively in the temperature range from room temperature to 8°C at most. And the variation of the residual stress in electroplated copper thin films during heat treatment was investigated from the viewpoint of the change of stress amplitude during a thermal cycle. From the obtained results, it was confirmed that the recrystallization occurred when the films were annealed at only 200°C, and the change of the micro textue of the films caused the change of their residual stress. Therefore, it is very important to control the micro texture during electroplating for assuring long term reliability of interconnections.

本文言語English
ホスト出版物のタイトルMicro- and Nano-Systems Engineering and Packaging
出版社American Society of Mechanical Engineers (ASME)
ISBN(電子版)9780791859476
DOI
出版ステータスPublished - 2019
イベントASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019 - Salt Lake City, United States
継続期間: 2019 11月 112019 11月 14

出版物シリーズ

名前ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
10

Conference

ConferenceASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019
国/地域United States
CitySalt Lake City
Period19/11/1119/11/14

ASJC Scopus subject areas

  • 機械工学

フィンガープリント

「Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル