Measurement of adhesion strength of solid-state diffusion bonding between nickel and copper by means of laser shock spallation method

M. Satou, H. Akamatsu, A. Hasegawa

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Coating and bonding techniques between different materials are essential to the field of technology. Bond mechanism is of interest from scientific point of view. A well-established method to make bonding between unalloyed nickel and copper was utilized, that was solid-state diffusion bonding at elevated temperatures. Irradiation by Nd:YAG laser with 7ns-pulse width created shock wave that caused tensile stress after reflection at free surface. The adhesion strength was determined by the critical laser power that caused exfoliation of the bonding interface.

本文言語English
ホスト出版物のタイトルShock Compression of Condensed Matter - 2009 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
ページ1131-1134
ページ数4
DOI
出版ステータスPublished - 2009 12 1
イベントConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM - Nashville, TN, United States
継続期間: 2009 6 282009 7 3

出版物シリーズ

名前AIP Conference Proceedings
1195
ISSN(印刷版)0094-243X
ISSN(電子版)1551-7616

Other

OtherConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM
国/地域United States
CityNashville, TN
Period09/6/2809/7/3

ASJC Scopus subject areas

  • 物理学および天文学(全般)

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