Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels

Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata, Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi

研究成果: Conference contribution

抄録

Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.

本文言語English
ホスト出版物のタイトルEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
出版社Institute of Electrical and Electronics Engineers Inc.
ページ219-221
ページ数3
ISBN(電子版)9781728142616
DOI
出版ステータスPublished - 2019 10
外部発表はい
イベント12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 - Haining, Hangzhou, China
継続期間: 2019 10 212019 10 23

出版物シリーズ

名前EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Conference

Conference12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
国/地域China
CityHaining, Hangzhou
Period19/10/2119/10/23

ASJC Scopus subject areas

  • 器械工学
  • 電子工学および電気工学
  • 安全性、リスク、信頼性、品質管理
  • 放射線

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