Macroporous silicon-based deep anisotropic etching

Yi Tao, Masayoshi Esashi

研究成果: Article査読

14 被引用数 (Scopus)

抄録

A novel micromachining technique for silicon deep anisotropic etching using macroporous silicon is developed. Macroporous silicon is formed selectively in n-type substrates using silicon anodization in a hydrofluoric acid (HF)-based electrolyte with backside illumination. Three-dimensional microstructures are fabricated by removing the macroporous silicon in alkali solutions. This technique enables us to etch (100) n-type silicon with arbitrary shaped windows to produce high-aspect-ratio structures with vertical sidewalls using a wet etching process.

本文言語English
ページ(範囲)764-770
ページ数7
ジャーナルJournal of Micromechanics and Microengineering
15
4
DOI
出版ステータスPublished - 2005 4 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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