Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Tetsu Yonezawa, Hiroki Tsukamoto, Yingqiong Yong, Mai Thanh Nguyen, Masaki Matsubara

研究成果: Article査読

44 被引用数 (Scopus)

抄録

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10-6 Ω m). This novel process may open a new strategy in the field of printed electronics.

本文言語English
ページ(範囲)12048-12052
ページ数5
ジャーナルRSC Advances
6
15
DOI
出版ステータスPublished - 2016
外部発表はい

ASJC Scopus subject areas

  • 化学 (全般)
  • 化学工学(全般)

フィンガープリント

「Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル